BoI Semiconductor / OSAT Packaging Programme
BoI Semiconductor / OSAT Packaging Programme is the Board of Investment of Thailand's targeted investment-promotion programme for semiconductor outsourced-assembly-and-test (OSAT) packaging capacity in Thailand. Provides tier-A tax holidays, customs-duty exemptions, and Smart Visa privileges for eligible OSAT investments. Targets capacity build-out at Hana Microelectronics, Stars Microelectronics, KCE Electronics, Cal-Comp, SVI, and inbound OSAT investors (ASE Holdings, Amkor, JCET). Aligned with Thailand's national semiconductor strategy and EEC tier-2 industrial-park positioning.
Profile overview
BoI Semiconductor / OSAT Packaging Programme is the Board of Investment of Thailand's targeted investment-promotion programme for semiconductor outsourced-assembly-and-test (OSAT) packaging capacity in Thailand. Provides tier-A tax holidays, customs-duty exemptions, and Smart Visa privileges for eligible OSAT investments. Targets capacity build-out at Hana Microelectronics, Stars Microelectronics, KCE Electronics, Cal-Comp, SVI, and inbound OSAT investors (ASE Holdings, Amkor, JCET). Aligned with Thailand's national semiconductor strategy and EEC tier-2 industrial-park positioning.
Programs
OSAT incentives
Tier-A OSAT packaging incentives
Tier-A BOI incentives covering 8-year corporate-income-tax holiday, 100% import-duty exemption on machinery and raw materials, and land-ownership rights for eligible OSAT investors. Targets ASE Holdings, Amkor, JCET, and equivalent OSAT operators.
Smart Visa
Talent visa for semiconductor engineers
Smart Visa S-type visa pathway enables foreign semiconductor engineers and executives to relocate to Thailand without work-permit restrictions. Critical for attracting OSAT engineering talent from Taiwan, South Korea, and Japan.
EEC zone
EEC semiconductor-cluster positioning
OSAT packaging investments are steered toward the Eastern Economic Corridor (Chonburi, Rayong, Chachoengsao) where industrial-estate infrastructure, port access, and BOI bonded-zone benefits align for export-oriented packaging operations.
Key OSAT operators in Thailand
Parent origin
Thailand (SET:HANA)
Products packaged
IC packaging, PCB assembly
BOI incentive status
Long-term BOI promoted
SVI PCL
ASE Holdings Thailand
Parent origin
Taiwan
Products packaged
Advanced IC packaging (flip-chip, SiP)
BOI incentive status
BOI tier-A eligible
| Company | Parent origin | Products packaged | BOI incentive status |
|---|---|---|---|
| Hana Microelectronics | Thailand (SET:HANA) | IC packaging, PCB assembly | Long-term BOI promoted |
| Stars Microelectronics | Thailand (SET:SMT) | IC packaging, EMS | BOI promoted |
| SVI PCL | Thailand (SET:SVI) | SMT, EMS, packaging | BOI promoted |
| ASE Holdings Thailand | Taiwan | Advanced IC packaging (flip-chip, SiP) | BOI tier-A eligible |
Watchpoints 2025–2026
US-China tariffs
Supply-chain diversification tailwind
US Section 301 tariffs on Chinese semiconductors and CHIPS Act restrictions are accelerating OSAT capacity diversification away from China. Thailand BOI OSAT incentives are directly positioned to capture this realignment.
Advanced packaging
Chiplet and SiP capability gap
Thailand's OSAT base is concentrated in mature wire-bonding and QFP packaging. Advanced packaging (chiplet integration, System-in-Package, 2.5D/3D IC) requires significant R&D and capital investment that most Thai OSATs lack.
Talent
Semiconductor engineer shortage
Thailand faces a structural shortage of semiconductor process and packaging engineers. BOI Smart Visa and KKU/Chulalongkorn semiconductor engineering programme expansion are insufficient for the scale of inbound OSAT investment demand.
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