Insight

Reference

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Supporting source

·Preview

Advanced packaging share of Thai OSAT

~8%

As ofFY2024·Sources3·Supporting

2.5D, 3D, chiplet, heterogeneous integration packaging is the emerging frontier — currently ~8% of Thai OSAT revenue but the strategic growth axis requiring substrate, bumping, thermal capability build-out.

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Figure in context

2.5D, 3D, chiplet, heterogeneous integration packaging is the emerging frontier — currently ~8% of Thai OSAT revenue but the strategic growth axis requiring substrate, bumping, thermal capability build-out.

2.5D, 3D, chiplet, heterogeneous integration packaging is the emerging frontier — currently ~8% of Thai OSAT revenue but the strategic growth axis requiring substrate, bumping, thermal capability build-out.

Time scope

FY2024

Source basis

Supporting source

Interpretation notes

What this tells you

2.5D, 3D, chiplet, heterogeneous integration packaging is the emerging frontier — currently ~8% of Thai OSAT revenue but the strategic growth axis requiring substrate, bumping, thermal capability build-out.

What not to do with it

Use the linked report for interpretation and keep basis differences explicit.

Related figures

Adjacent numbers that add context without drowning the value.

FY2024
#2

Thailand OSAT rank in ASEAN

SEMI SEA chapter, FTI OSAT working group

FY2024
~THB 75-80B

Hana Microelectronics FY2024 revenue

HANA 56-1, consolidated financial statements

FY2024
~32%

Wirebond share of Thai OSAT revenue

TrendForce, Gartner, IC Insights

FY2024
~USD 1.5B

Intel Vietnam packaging, test hub investment

Intel disclosures, SEMI SEA

Report context

Thailand Semiconductor OSAT Deep Dive

Deep-dive into Thailand's semiconductor OSAT (Outsourced Semiconductor Assembly, Test) industry — Thailand is ASEAN's #2 OSAT hub after Malaysia. Key operators: Hana Microelectronics (SET: HANA) Lamphun, Ayutthaya scale leader; KCE Electronics (SET: KCE) Ayutthaya PCB, substrate, assembly; Delta Electronics Thailand (SET: DELTA) Bangkok, Samut Prakan EMS, power electronics; Cal-Comp Electronics (SET: CCET) Phetchaburi; Stars Microelectronics (SET: SMT). Foreign captives: Onsemi Thailand Bang Pa-In, Seagate Thailand HDD, component, Western Digital Thailand, Sumitomo Mitsubishi Silicon (SUMCO) Rayong wafer supply. OSAT services: IC packaging (wirebond, flip-chip, QFN, BGA, SiP, module), wafer test, final test, burn-in. Customer base: Onsemi, Infineon, NXP, Texas Instruments, STMicro, Analog Devices, Broadcom. BOI Category 5, Category 8 advanced-packaging incentives. Thai OSAT competes with Malaysia (Carsem, Inari, ViTrox), Vietnam (Intel Vietnam), China, Taiwan. Advanced packaging (2.5D, 3D, SiP, chiplet, heterogeneous integration) is the emerging frontier.

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Atlas actors in this figure's reports

Profiles covered in the report that cite this number.

Cal-Comp Electronics (Thailand)

Kinpo Taiwan-parent listed EMS; printers, networking, IoT, PC OEM; FY2024 revenue ~THB 65B.

Hana Microelectronics

Listed Thai EMS, IC packaging, PMIC, RFID; Thailand, Cambodia plants; FY2024 revenue ~THB 25B.

KCE Electronics

Listed Thai PCB manufacturer; automotive, consumer, industrial PCBs; FY2024 revenue ~THB 15B.

Seagate Thailand

Ireland-HQ global HDD duopoly player; major Thai manufacturing hub; HDD, head, media production.

Stars Microelectronics

Listed Thai semiconductor packaging, test, EMS specialist; smaller-scale OSAT peer to Hana.

Western Digital Thailand

US-parent MNC HDD, slider manufacturing hub; private Thai subsidiary; major HDD production centre globally.

Advanced packaging share of Thai OSAT · Insight