Reference

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Supporting source

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Wirebond share of Thai OSAT revenue

~32%

As ofFY2024·Sources3·Supporting

Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.

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Figure in context

Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.

Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.

Time scope

FY2024

Source basis

Supporting source

Interpretation notes

What this tells you

Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.

What not to do with it

Use the linked report for interpretation and keep basis differences explicit.

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Wirebond share of Thai OSAT revenue · Insight