Reference
·Supporting source
·PreviewWirebond share of Thai OSAT revenue
~32%
Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.
Figure in context
Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.
Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.
Time scope
FY2024
Source basis
Supporting source
Interpretation notes
What this tells you
Wirebond (legacy, cost-sensitive) IC packaging leads the Thai OSAT service mix, followed by QFN, BGA, flip-chip ~28%, test, burn-in ~16%, SiP, module ~16% and advanced packaging ~8%.
What not to do with it
Use the linked report for interpretation and keep basis differences explicit.
Related figures
Adjacent numbers that add context without drowning the value.
Thailand OSAT rank in ASEAN
SEMI SEA chapter, FTI OSAT working group
Hana Microelectronics FY2024 revenue
HANA 56-1, consolidated financial statements
Advanced packaging share of Thai OSAT
SEMI, TrendForce, DEPA-NSTDA-NECTEC-TMEC
Intel Vietnam packaging, test hub investment
Intel disclosures, SEMI SEA
Report context
Atlas actors in this figure's reports
Profiles covered in the report that cite this number.